• Home
• Industries
  • Steel / Non-Ferrous metals
  • Petroleum / Chemicals / Materials
  • Oil&Gas
  • Electrical equipment / Electronics / Semiconductors
  • Material Handling
  • Automobiles / Machinery
  • Food / Medicines
  • Paper
• Solutions
  • Concept
  • Green Factory Innovation
  • Motor & Drive Systems
  • Automation Systems
  • Substation and Generation Systems
  • Production-line innovation systems
• Products
  • Development of Advanced Technologies
  • Power Electronics
  • Rotating machinery
  • Production-line innovation systems
• Site Library
• News
• About
  • Message from President and CEO
  • About TMEIC brand
  • CSR
  • Corporate Profile
    • TMEIC Corporation Profile
  • History
  • Network in Japan
  • Global network
  • Procurement

Leading-edge technology

Ozone Gas Generating System

Features

1. Generation of ultra-high concentration ozone gas by adopting the nitrogen non-adding method

The development of this unique construction electrode has achieved the ultra-high concentration of 400g/m³(N) maximum in the industry.

2. Restriction in generation of metal contaminant by adopting the nitrogen non-adding method

It is possible for clean ozone gas (of which nitrogen oxide generation is restricted to its ultimate limit*1) to maintain the desired quality for miniaturizing the pattern, and to enhance the film quality.
*1: Nitrogen oxide concentration 0.01ppm or less (1/10000 as comparison with our previous model)

3. Succession of unique ultra-short gap discharge technology

The generator of this type has succeeded the ultra-short gap discharge technology with excellent start-up characteristics, stability and cooling efficiency.

4. Compatible to international standard

Compliance with CE marking and SEMI-S2

H series Generates the industry's leading super-high concentration ozone gas without using nitrogen additives. ·Main applications… Semiconductor manufacturing processes, etc Details P series Generates clean ozone gas using only highly pure oxygen without nitrogen additives. ·Main applications… Semiconductor manufacturing processes, etc. Details C series Generates clean ozone gas suitable for semiconductor manufacturing processes. ·Main applications… Semiconductor manufacturing processes, etc. Details N series Generates high concentration ozone gas using common oxygen. ·Main applications… Semiconductor manufacturing processes, chemical processes, food manufacturing processes, water treatment, etc. Details

Ozone Water Producing System

Arrangement of OW-U series

U series Manufacture of clean ozone water suitable for semiconductor manufacturing processes. ·Main applications… Semiconductor manufacturing processes, precision machine part cleaning, etc. Details

Busbar Bonding Machine

Features

1. TMEIC's unique bonding machine.

2. Bonds lead wire to the thin plate glass directly.

3. Forms busbars without heat, solder materials, or consumables.

4. Obtains low contact resistance, and improves electrical property.

5. Damages to the glass can be reduced by the original technology.

Basic Specifications ·Automatic tension-control of lead wire. ·Monitoring System (Manufacturing Conditions, Trace of Bonding). ·Exchangeable tip (tool) ·Anvil & Fixing Structure (reduces damage to the glass). Bonding Achievements ·Glass thickness [mm]: 0.65 ~ 4 ·Surface material of the glass ·Raw glass ·Thin film deposited (ITO, ZnO, Ag, Cr, Al, Ti, Ni, etc.) ·Size of the plate glass [mm] □100, □300, 500 x 1000, 600 x 1200 etc.

PAGE TOP